Description

• Delivers the right amount of solder with high-speed snap-off and reduced solder waste.
  
• Advanced M2M communication with the AOI/SPI and patented feedforward communication to the mounter delivers overall productivity and quality.
  
• The inherent SPG2 print capability supports 0201mm (008004”) components, as well as bump printing.
  
• 510 x 510 PCB (optional 650mm long board kit) and auto pin setup for high mix environments.
  
• Print capability to process microchip, to bumping, to pin-in-paste applications.
  
• Advanced features of auto stencil, auto paste removal/deposit paperless cleaning and auto paste dispense options for Factory of the Future capabilities.
  
• 14s processing time including all required functions (transfer, fiducials, print, clean) to ensure fast and quality printing.