Parmi is a global benchmark in the manufacturing of 3D optical inspection systems (SPI and AOI), specializing in guaranteeing absolute quality in the assembly of electronic circuits and semiconductors.

It's value proposition is based on proprietary dual-laser sensor technology, designed to eliminate measurement errors by scanning from two angles. This allows for the inspection of high-density components without interference from optical shadows.

• High-Precision 3D Inspection: Microscopic defect detection in soldering and assembly through real volumetric measurements.
• Dual Scan Technology: A key differentiator that eliminates shadows for total visibility in complex components.
• SPI and AOI Control: Critical verification of solder paste and post-assembly component positioning.
• Semiconductor Solutions: High-fidelity equipment for microchip packaging and wafer inspection.
• Process Optimization: Real-time data analysis to reduce waste and maximize production line efficiency.